Chips that Shine, Connections that Count—NAURA at SEMICON

From March 17 to 22, SEMICON China 2024 and CSTIC 2024 were held in grand fashion in Shanghai. More than a thousand global exhibitors showcased cutting-edge technologies and innovations spanning the entire semiconductor value chain—from chip design, equipment, and materials to advanced packaging and testing. NAURA sincerely thanks industry peers from around the world for visiting its booth and joining in this celebration of technological innovation and forward-thinking.

At this year's event, NAURA made a compelling appearance with its high-end semiconductor process solutions, including ETCH, Thin Film, Diffusion, and Wet process equipment, along with core component technologies. The company actively participated in the IC Manufacturing Supply Chain International Forum, the Heterogeneous Integration (Advanced Packaging) International Conference, and the International Forum on Power and Compound Semiconductors. It also delivered multiple technical presentations at CSTIC 2024, engaging global experts in exploring how China's semiconductor industry can seize emerging innovation opportunities.

As one of China's premier semiconductor events^[1], SEMICON China took place from March 20 to 22, 2024. At the opening ceremony, Mr. Zhao Jinrong, Chairman of NAURA Group, delivered a keynote titled New Opportunities in the IC Equipment Industry in the AI Era. He emphasized that AI, as a transformative force, is reshaping the landscape of IC equipment, and highlighted its strategic importance for redefining the future of advanced manufacturing. Chairman Zhao pointed out that the AI era brings exponential opportunities in data collection, storage, communication, security, and computing, creating vast space for innovation across the semiconductor industry. NAURA, he stated, is committed to seizing this momentum and continuing to innovate in IC equipment to accelerate high-quality industry development.

As a leading domestic semiconductor equipment provider^[2], NAURA remains customer-centric and innovation-driven. With over two decades of deep expertise, the company has developed a robust product portfolio with advanced performance across Etch, Thin Film, Diffusion, and Wet process technologies. These solutions serve a broad range of applications—from ICs and power semiconductors to 3D integration, advanced packaging, compound semiconductors, emerging technologies, and research, delivering full-stack solutions to its customers. Throughout SEMICON China 2024, NAURA presented innovations in IC equipment and technologies, advanced packaging, and the silicon carbide industry across multiple technical forums.

[1] Source: SEMI official website, introduction to SEMICON China

[2] Source: SEMI official WeChat article–CSTIC 2023: Grand Opening of the China Semiconductor Technology International Conference

IC Manufacturing Supply Chain International Forum

Mr. Dong Boyu, President of NAURA Microelectronics, delivered a presentation titled Thin Film Technology and Semiconductor Equipment: Challenges, Opportunities, and Solutions. He emphasized that semiconductor equipment serves as the ballast for sustainable development in the AI era. As chip technologies rapidly evolve, new materials, architectures, and processes continue to push the boundaries, creating higher demands on thin film tools. Mr. Dong outlined NAURA's comprehensive deployment of PVD, CVD, ALD, and EPI technologies, and its commitment to providing customers with cutting-edge solutions.

Heterogeneous Integration (Advanced Packaging) International Conference

Ms. Wang Na, Executive Vice President of Strategy at NAURA Microelectronics, gave a presentation titled Domestic Equipment Empowering the Takeoff of the Advanced Packaging Industry in the Era of Computing Power. She explored how large-scale AI models are reshaping the semiconductor landscape, and highlighted the central role of advanced packaging in enabling AI transformation and digitalization. Ms. Wang also shared NAURA's innovative 2.5D/3D packaging solutions and called for industry-wide collaboration to accelerate progress in the chip industry.

International Forum on Power and Compound Semiconductors

Mr. Li Shiqun, General Manager of NAURA Microelectronics at the International Forum on Power and Compound Semiconductors, presented on Demand Leadership, Technological Innovation, Building a New Ecosystem for China's Silicon Carbide Industry. Using multidimensional data, he outlined the booming prospects of China's SiC industry and the growing applications in EVs, photovoltaics, energy storage, and AI. He also shared NAURA's full suite of equipment solutions, covering crystal growth, epitaxy, etching, thin film, furnace systems, and cleaning.

As a featured exhibitor at this landmark event, NAURA expresses its gratitude to SEMICON China for providing a vital platform that enables cross-sector exchange and collaboration. Looking ahead, NAURA will continue to collaborate sincerely with partners across the semiconductor value chain, driving progress, enabling transformation, and creating infinite possibilities.