NAUR Shines at SEMICON China 2023—NAURA Links to the World of Semiconductors
Exhibition Venue： Shanghai New International Expo Centre
Exhibition Date：June 26-July 1, 2023
From June 26 to July 1, SEMICON China 2023 unfolded in grand scale in Shanghai. More than 1,100 global exhibitors participated in over 20 parallel conferences and events, presenting leading-edge technologies and products across the entire semiconductor supply chain—from chip design to equipment, materials, manufacturing, and packaging & testing. Spanning 90,000 square meters, the exhibition set a new record for SEMICON China.
NAURA made a high-profile appearance, showcasing its advanced semiconductor process equipment and core component solutions, including ETCH, Thin Film, Diffusion, and Wet process systems. The company actively participated in several thematic forums such as the IC Manufacturing Supply Chain Development Forum, the International Forum on Power and Compound Semiconductors, and Advanced Packaging and Heterogeneous Integration. In addition, NAURA was invited to deliver multiple technical presentations at the China Semiconductor Technology International Conference (CSTIC) 2023, engaging in high-level dialogue with global industry leaders on the future of semiconductors.
Held on June 26–27, CSTIC 2023 marked another successful edition of Asia’s largest and most comprehensive annual semiconductor technology conference[1]. Zhao Jinrong, Chairman of NAURA Group, delivered a keynote speech at the opening ceremony titled “Relentless Innovation in IC Equipment Technology”. In his address, he shared the evolution of IC equipment development and highlighted key innovations that are enabling breakthroughs in response to new processes and technologies.
Zhao emphasized that integrated circuits will remain the most vital industrial technology for global economic development over the next three decades, offering immense potential for innovation. Yet as chip technologies evolve, they increasingly face challenges across five key dimensions: die area, cost, power consumption, performance, and time-to-market. He outlined multiple directions and pathways for innovation in IC technologies, using NAURA’s own experience to illustrate targeted approaches to advancing process equipment innovation.
[1] Source: SEMI official website–Introduction to the China Semiconductor Technology International Conference 2023
[2] Source: SEMI official WeChat article–CSTIC 2023: Grand Opening of the China Semiconductor Technology International Conference
As a leading domestic supplier of semiconductor equipment[1], NAURA remains committed to its vision: to be a trusted industry leader in foundational semiconductor products. With a customer-centric mindset and a long-term focus on innovation, NAURA has developed a broad portfolio of advanced, high-performance products over the past two decades, spanning etch, thin film deposition, oxidation/diffusion, and cleaning systems. These solutions are widely adopted in high-tech fields such as ICs, advanced packaging, and compound semiconductors, and can be customized to meet diverse client needs.
On June 30, during several SEMICON China 2023 forums, NAURA shared its latest innovations and solutions in fields such as silicon carbide (SiC) and advanced packaging.
International Forum on Power and Compound Semiconductors
At the International Forum on Power and Compound Semiconductors, Wang Na, Vice President of Strategic Development at NAURA Microelectronics, presented a report titled “Unwavering Commitment to Equipment Innovation for High-Quality SiC Industry Development”. Her presentation provided an in-depth, data-driven analysis of the SiC market’s enormous potential over the coming decade, stating that China is poised to become the world’s leading center for SiC innovation and supply. Amid the rapid growth of the SiC industry, NAURA is accelerating its R&D efforts. Through ongoing technological iteration and innovation, the company continues to refine its products and services to help drive high-quality development across the SiC sector.
IC Manufacturing Supply Chain Development Forum
At the IC Manufacturing Supply Chain Development Forum, Dr. Jiang Zhongwei, Director of Etch Process at NAURA Microelectronics, delivered a presentation titled “Precision Etching: Technology Evolution and Solutions”. Starting with the trajectory of semiconductor technology development, Dr. Jiang highlighted how the transition from traditional 2D planar devices to 3D architectures, and the introduction of new materials and novel device structures, has posed significant challenges for etch uniformity control and high aspect ratio etching. He then shared NAURA’s targeted solutions to address these emerging complexities.
Advanced Packaging Forum–Heterogeneous Integration
At the "Advanced Packaging Forum–Heterogeneous Integration", Xie Qiushi, Deputy General Manager of the Etch Business Unit at NAURA Microelectronics, gave a talk titled “Process Challenges and Solutions for 2.5D & 3D Integration.” He explored the critical role of 2.5D and 3D TSV technologies in the post-Moore era, addressing both the opportunities and the obstacles they bring. TSVs form a core component of advanced packaging, yet recent years have seen mounting challenges related to technical complexity, cost, and supply chain integration. As a key enabler connecting upstream and downstream players, equipment manufacturers are well-positioned to take the lead. NAURA is committed to confronting these challenges head-on by offering comprehensive equipment solutions. The company calls for close collaboration across the industry to build a resilient and fully integrated ecosystem.
The advancement of new IC processes and technologies shows no sign of slowing. Ever more sophisticated semiconductor equipment continues to emerge. NAURA encourages all industry peers to work in unison, embrace the momentum, and return to next year’s event with even greater achievements and innovations!
